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ISTFA 2019: Proceedings from the 45th International Symposium for Testing and Failure Analysis

By: ASM International

1627082735 / 9781627082730
Paperback / softback
30/05/2020
Published 30/05/2020
United States
538 pages
Professional & Vocational  Learn More

The theme for the 2019 ISTFA conference was Novel Computing Architectures.

Papers include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies.

These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

BIC:

TDM Metals technology / metallurgy

Our price£157.58
RRP £191.00
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