SiC power module design : performance, robustness and reliability

High-frequency switching power semiconductor devices are at the heart of power electronic converters.

To date, these devices have been dominated by the well-established silicon (Si) technology.

However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion.

Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime.

Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging. This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs. Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies.

The book is a valuable reference for researchers and experts in academia and industry.