Design and Test of MEMS/MOEMS

This timely collection includes the complete proceedings of the 1999-2001 Design, Test, Integration and Packaging of MEMS and MOEMS (DTIP) conferences held in France (Proc.

SPIE Volumes 3680, 4019, and 4408); the 1999 conference on Design, Characterization and Packaging of MEMS/MOEMS held in Australia (Proc.

SPIE Volume 3893); the 2000 Conference on Design, Modeling, and Simulation in Microelectronics held in Singapore (Proc.

SPIE 4228); and, the 2001 Conference on Reliability, Testing, and Characterization of MEMS/MOEMS held in the U.S. (Proc. SPIE Volume 4558). Together, these papers form a comprehensive and detailed survey of design, modeling, simulation, characterization, integration, reliability, testing, and packaging of micro-electro-mechanical systems (MEMS) and micro-electro-optical-mechanical systems (MOEMS).