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Design and modeling for 3D ICs and interposers - vol. 2

Part of the WSPC series in advanced integration and packaging, series
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3D integration is being touted as the next semiconductor revolution.

This book provides comprehensive coverage on the design and modeling aspects of 3D integration, in particular, there is a focus on its electrical behaviour.

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£195.00
Product Details
World Scientific Publishing
9814508608 / 9789814508605
eBook (Adobe Pdf, EPUB)
24/12/2013
Singapore
English
355 pages
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