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Components, Packaging and Manufacturing Technology

Wu, Yanwen(Edited by)
Part of the Key Engineering Materials series
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Volume is indexed by Thomson Reuters CPCI-S (WoS). The objective of this special collection is to provide a showcase for researchers, educators, engineers and government officials, involved in the general areas of Components, Packaging and Manufacturing Technology, by which to highlight the latest research results and to exchange views on the future direction of research in these fields.

The topics covered include: Advanced Measurement, Test and Information Technology, Components, Packaging and Manufacturing Technology.

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Product Details
Trans Tech Publications Ltd
0878492135 / 9780878492138
Paperback / softback
670
30/04/2011
Switzerland
870 pages, Illustrations, unspecified
170 x 240 mm, 1100 grams
Professional & Vocational/Postgraduate, Research & Scholarly Learn More