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Cooling of microelectronic and nanoelectronic equipment: advances and emerging research - vol. 3

Geisler, Karl J L(Edited by)Iyengar, Madhusudan(Edited by)Sammakia, Bahgat G(Edited by)
Part of the WSPC Series in Advanced Integration and Packaging series
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This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions.

It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.

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£272.00
Product Details
World Scientific Publishing
9814579793 / 9789814579797
eBook (Adobe Pdf, EPUB)
621.38
23/10/2014
Singapore
English
459 pages
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