EMPMD Symposium : Advanced Metallizations and Interconnect Technologies, in Honor of Prof. K.N. Tu's 70th Birthday

These papers are based on presentations prepared for the symposium EMPMD Symposium: Advanced Metallizations and Interconnect Technologies, in Honor of Prof.

K.N. Tu's 70th Birthday. The original symposium description is as follows: "This symposium will honor the outstanding contributions of Professor King-Ning Tu to materials science and engineering in a career that spans 40 years at IBM T.J.

Watson Research Center, Cornell University, and University of California at Los Angeles.

Professor Tu has dedicated his career to the understanding and application of diffusion and reactions in metallic thin films, silicide formation, as well as in solder alloys.

Moreover, Professor Tu provided the education and traineeship for many students.

This symposium, in honor of his 70th birthday, will highlight both experimental and theoretical work in silicide formation, diffusion and reactions in metallic thin films, interconnect and solder joint reliability.In addition to invited speakers, contributed papers on the topics listed below are solicited. Topics of relevance include, but are not limited to, diffusion and reactions in solder alloys, silicide formation, diffusion and reactions in metallic thin films, diffusion and reactions in Si, SiO2 and low k materials, electromigration and other driving forces of diffusion, kinetic theory of flux-driven phase changes."